| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition and an epoxy molding material having compatibilized of quick curability, high fluidity and high storage stability, and to obtain a semiconductor device using the molding material. SOLUTION: This thermosetting resin composition comprises (A) a compound having two or more epoxy groups in a molecule, (B) a compound having two or more phenolic hydroxy groups in a molecule and (C) a phosphonium compound as indispensable components. The epoxy resin molding material comprises the composition. The semiconductor device is sealed by the cured product of the molding material.
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