发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition which is excellent in impact resistance, low water-absorption and creep resistance under a high temperature and a high humidity, and is suitable for an automobile electric connector. SOLUTION: The composition comprises (A) 99-60 parts by weight of a polyamide resin having a melting point of 280 deg.C and higher and less than 300 deg.C, a terminal amino group concentration of 10-150 mmol/kg and a limiting viscosity of 0.5-3.0 dl/g as measured in 96.5% sulfuric acid at 25 deg.C and (B) 1-40 parts by weight of a graft modified polymer having a graft modification of 0.01-10% by weight, wherein the polyamide resin is composed of the repeating units which consists of (a) diamine component units composed of aliphatic diamine component units having 8-10C straight chains and/or side chains and (b) dicarboxylic acid component units composed of 60-100 mol% of terephthalic acid component units, 0-40 mol% of aromatic dicarboxylic acid component units excluding terephthalic acid component units and/or 0-40 mol% of 4-20C aliphatic dicarboxylic acid component units.
申请公布号 JP2002179910(A) 申请公布日期 2002.06.26
申请号 JP20000376422 申请日期 2000.12.11
申请人 MITSUI CHEMICALS INC 发明人 SAWADA MASAHIRO
分类号 C08J5/00;C08G69/28;C08L77/06;H01R13/46;(IPC1-7):C08L77/06 主分类号 C08J5/00
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