Method of handling a thin wafer

摘要

A wafer is loaded on a 0.3-to-2.5 mm thick transportable electrostatic holder (TEH) charged/discharged inductively without any contact. The THE has an integrated electric charging/discharging device fed by a battery or an accumulator. Electrostatic charging/discharging is controlled remotely and done separately in one or more mobile or stationary interconnecting stations. The TEH can also be recharged/discharged in a processing machine loading station.