发明名称 |
Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
摘要 |
A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability printed wiring board.
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申请公布号 |
US6409869(B1) |
申请公布日期 |
2002.06.25 |
申请号 |
US19990355455 |
申请日期 |
1999.09.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YAMANE SHIGERU;NISHII TOSHIHIRO;NAKAMURA SHINJI;SAKAI MASAYUKI |
分类号 |
B23K26/00;B23K26/12;B23K26/38;H05K3/00;H05K3/22;H05K3/40;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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