| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing surface observing device capable of optically observing the state of the polishing surface of a material to be polished in a wide range. SOLUTION: An irradiation light from a light projecting/receiving device 7 progressing vertically downward is incident on a transparent polishing surface plate 3, changed the direction 90 deg. by a reflecting mirror body 10 to advance in the horizontal direction, and again changed the direction 90 deg. by a reflecting mirror body 9 to advance vertically downward. The light is applied on the surface of a wafer 1 through a transparent window provided in a polishing body 4. The reflecting light from the wafer 1 is received by the light projecting/ receiving device 7 by reversely following the same direction of the irradiation light. The use of the reflecting mirror can thus set the observation point to the center part of the polishing surface plate, which was impossible for the conventional device, and observe the surface state of the wafer 1 in a wide range.
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