Multi-beam emitting device

摘要

A semiconductor laser device includes a metal case. The metal case includes a brass stem and a cap that covers an upper portion of the stem and has a laser emitting hole therein. The stem is provided with a laser diode having two laser emitting portions and a photodiode. Each cathode of the laser emitting portions and the photodiode is grounded to the metal case as a common lead. Each anode of the laser emitting portions and the photodiode is insulated from the metal case and connected to respective pin protruding downward from the stem. The semiconductor laser device is provided with conductivity to the metal case by press-fitting into an aluminum support plate that is a radiating plate. The support plate is connected to a drive circuit.