发明名称 |
RF electronics assembly with shielded interconnect |
摘要 |
An electronics assembly incorporating an interconnect includes a conductive gasket disposed between a first printed circuit board and a second printed circuit board. The gasket surrounds, and thereby shields, the interconnect while providing an RF ground connection between the two boards with a controlled RF impedance. The second printed circuit board may serve as a connector board for a plurality of modules, or other printed circuit boards, to be coupled thereto. Each module is individually covered with a separate lid. Methods for manufacturing and assembling structures according to the invention are also provided.
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申请公布号 |
US6411523(B1) |
申请公布日期 |
2002.06.25 |
申请号 |
US20000718819 |
申请日期 |
2000.11.22 |
申请人 |
POWERWAVE TECHNOLOGIES, INC. |
发明人 |
ROBERSON JAMES HIRAM;VEITSCHEGGER WILLIAM KERR;WONG KEN |
分类号 |
H05K1/02;H05K1/14;H05K3/00;H05K3/34;H05K3/36;H05K9/00;(IPC1-7):H05K7/14;H01R12/16 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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