发明名称 DOUBLE-HEAD SURFACE GRINDING DEVICE WITH WASHING DEVICE FOR GRINDING WHEEL AND WASHING METHOD FOR THE GRINDING WHEEL
摘要 PROBLEM TO BE SOLVED: To prevent the lowering of grinding efficiency and precision by preventing the deterioration in cutting sharpness of a rotary grinding wheel caused by loading generated in the rotary grinding wheel and prevent the warp etc., of a wafer caused by the lowering of the grinding precision by eliminating the difference in the cutting sharpness in upper/lower rotary grinding wheels. SOLUTION: This double-head surface grinding device is provided with the lower rotary grinding wheel 15 and an upper rotary grinding wheel 16. The grinding operation surface of the grinding portion 15A in the lower rotary grinding wheel 15 and the grinding operation surface of a grinding portion 16A in the upper rotary grinding wheel 16 are parallel to each other. This grinding devise is provided with a nozzle 60 for washing the grinding wheel portions 15A and 16A by spraying high-pressure washing liquid after completing the grinding work.
申请公布号 JP2002178258(A) 申请公布日期 2002.06.25
申请号 JP20000379840 申请日期 2000.12.14
申请人 NIPPEI TOYAMA CORP 发明人 MURAI SHIRO;OKUYAMA TETSUO;KAWAZU TOMOYUKI
分类号 B24B7/17;B24B53/007;B24B55/06;(IPC1-7):B24B53/007 主分类号 B24B7/17
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