SUBSTRATE TREATMENT APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of accurately treating a substrate by a wet process and capable of washing even the back surface of the substrate. SOLUTION: In the substrate treatment apparatus 2, the substrate W is held on a rotary support plate 21 and subjected to rotary treatment in the treatment space S formed between an upper rotary plate 41 and the rotary support plate 21 so as to hold the substrate W. A liquid nozzle 34 has a nozzle orifice 34a formed thereto so as to face to the center of the back surface of the substrate W. Nitrogen gas discharge orifices 35c are equally formed to the periphery of the nozzle orifices 34a. A gas supply passage 35 is connected to a conduit 35b through a gas storage part 35a and the leading end of the conduit 35b is connected to the discharge orifices 35c. The conduit 35b is inclined so as to eject nitrogen gas to the vicinity of the center of the substrate W.