| 摘要 |
An implantable medical device is made from an electronic subassembly hermetically sealed in a ceramic case filled with a potting material. Use of the potting material enhances the capacity of the device to withstand mechanical shock without failure. The device includes a hollow ceramic or other case having an open end to which a metal ring is hermetically bonded. The inside surface of the ceramic case is treated (cleansed and activated) to assure the potting material adheres to it. The potting material, while in a non-cured fluid or quasi-fluid state, is inserted inside of the ceramic case. The electronic circuitry is next inserted into the open end of the ceramic case while the potting material is still in a non-cured, soft or fluid state. The electronic circuitry displaces some of the potting material and the potting material fills the voids between the electronic circuitry and the ceramic case. The potting material is then slowly cured, and once cured, supports the walls of the ceramic case and protects the electronic circuitry embedded therein. A header (to which the electronic circuitry is attached) is hermetically bonded to the metal band on the open end of the ceramic case, thereby hermetically sealing the implantable device.
|
