| 摘要 |
A circuit board has traces attached to a flexible trace surface such that the traces can be displaced in a direction of thermal expansion of a component attached to the traces without causing the failure of the solder joint between the component and the trace. In one embodiment, the printed circuit board substrate is etched away in areas not covered by the traces such that flexible protuberances are formed from the substrate underneath the traces. In one method for constructing such a circuit board, a conductive layer is deposited on the printed circuit board substrate. The conductive layer is then etched to form conductive traces. The printed circuit board substrate is then selectively etched using the traces as a mask for etching the printed circuit board substrate. In a second printed circuit board embodiment, a flexible layer of a material is deposited onto the printed circuit board substrate. The traces are then formed on top of the flexible layer. The flexible layer allows the traces to move in the direction of thermal expansion of an attached component without causing failure of the solder joint between the trace and the component.
|
