发明名称 Resin composition
摘要 A resin composition characterized by comprising from 5 to 95 wt % of an aromatic vinyl compound/olefin random copolymer (A) which has an aromatic vinyl compound content of from 1 to 99 mol % and has a head-to-tail chain structure composed of two or more aromatic vinyl compound units, and from 95 to 5 wt % of an alpha-olefin type polymer (B) and/or an aromatic vinyl compound type polymer (C) (provided that it is neither a medical material nor a medical device), which contains substantially no chlorine and is excellent in the impact resistance, moldability, weather resistance and chemical resistance and which is useful for an injection molded product, an extrusion molded product, a film, a sheet, etc. Further, it provides an excellent damping material.
申请公布号 US6410649(B1) 申请公布日期 2002.06.25
申请号 US20000646771 申请日期 2000.09.22
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 ODA TAKESHI;SUZUKI SHIGERU;ARAI TORU;OKAMOTO AKIO;NAKAJIMA MASATAKA;TOYA HIDEKI
分类号 C08L23/02;C08L23/04;C08L23/06;C08L23/08;C08L23/12;C08L25/06;C08L53/02;(IPC1-7):C08L23/00;C08L23/36;C08L25/00;C08L25/18;C08L25/02 主分类号 C08L23/02
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