DOUBLE-SIDED ADHESIVE TAPE FOR SEMICONDUCTOR DIE BONDING

摘要

The present invention relates to a double-sided adhesive tape for semiconductor die bonding which comprises a base film made of polyamide, an adhesive layer formed one both sides of the base film, and a protection film formed on at least one surface of the adhesive layer. According to the double-sided adhesive tape for semiconductor, the thickness of the base film except the protection film is optimized to be 75 to 85% of the total thickness. Thereby, heat resistance and adhesion are maintained. Also, the generation of supply failure that a tape is rolled by a supply roll when the tape is supplied, or the tap is pressed and attached to a supply die, is prevented. So, cost saving can be achieved in a system scale, by improving process failure rate.