发明名称 |
Method and apparatus for depositing and controlling the texture of a thin film |
摘要 |
The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a "proximity" plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a "cold worked" manner. In this manner, energy stored in the cold worked regions of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.
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申请公布号 |
US6409904(B1) |
申请公布日期 |
2002.06.25 |
申请号 |
US19990373681 |
申请日期 |
1999.08.13 |
申请人 |
NUTOOL, INC. |
发明人 |
UZOH CYPRIAN EMEKA;TALIEH HOMAYOUN |
分类号 |
B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24B37/26;C25D5/00;C25D5/02;C25D5/06;C25D5/22;C25D7/12;C25D17/14;C25F7/00;H01L21/00;H01L21/288;H01L21/321;H01L21/768;H01L23/532;(IPC1-7):C25D5/52;C25D5/50 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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