SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can prevent semiconductor chips from being out of alignment in a process of division into a plurality of semiconductor chips and a process of increasing intervals among the plurality of semiconductor chips.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming trenches W5 with a cutting depth shallower than a thickness of a semiconductor wafer W on a first surface W1 of the semiconductor wafer W; a process of attaching a first adhesive sheet 10 to a first surface W1 where the trenches W5 are formed; a process of grinding a second surface W6 of the semiconductor wafer W to decrease a thickness of the semiconductor wafer W and dividing the semiconductor wafer W into a plurality of semiconductor chips CP; a process of attaching a second adhesive sheet to a third surface W3 exposed by grinding of the second surface W6; a process of removing the first adhesive sheet 10; and a process of stretching the second adhesive sheet to increase intervals among a plurality of semiconductor chips CP.SELECTED DRAWING: Figure 1