发明名称 |
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections |
摘要 |
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections in a semiconductor package is disclosed. A semiconductor device has active devices on the front surface, a first through-chip conductor having first electrical/physical characteristics passing from the front surface of the device to the back surface, a second through-chip conductor having second electrical/physical characteristics passing to the back surface, and an off-chip or chip-to-chip connector electrically connecting the active devices on the front surface to a different level of packaging.
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申请公布号 |
US6410431(B2) |
申请公布日期 |
2002.06.25 |
申请号 |
US20000746534 |
申请日期 |
2000.12.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERTIN CLAUDE LOUIS;HOWELL WAYNE JOHN;TONTI WILLIAM R.;ZALESINSKI JERZY MARIA |
分类号 |
H01L23/13;H01L23/367;H01L23/48;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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