Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip

摘要

A plurality of multi-chip modules are incorporated in a semiconductor device. Each of the multi-chip modules has a plurality of functional parts mounted on a circuit board. A flexible wiring board connects the multi-chip modules to each other. An interface part is mounted on the flexible wiring board so as to control input and output signals of the multi-chip modules.