发明名称 Compliant thermal interface devices and method of making the devices
摘要 A compliant, thermally conductive interface device for use between two surfaces, such as a component and a heat sink surface, that can accommodate a range of gap distances and angular misalignment (tilt). The device is comprised of a plurality of foils (28) stacked in a densely-packed, nested fashion. The foils may extend between the surfaces (30, 32). Embodiments are described for use with flat, two-dimensionally curved, three-dimensionally curved, and cylindrical surfaces (such as heat pipes). Preferably, the foils are pre-formed in a shape corresponding to their fully compressed shape in a device and stacked directly against each other. After bonding the plurality of adjacent foil proximal edges (34) together and the plurality of adjacent foil distal edges (38) together, the assembly is extended to produce interstitial separation distances (42) between adjacent foil flexing sections (36) to accommodate future flexing and the height to accommodate future compression and tilt.
申请公布号 US6411513(B1) 申请公布日期 2002.06.25
申请号 US20000731014 申请日期 2000.12.07
申请人 BEDARD JACQUES NORMAND 发明人 BEDARD JACQUES NORMAND
分类号 H01L23/367;H01L23/433;(IPC1-7):H05K7/20 主分类号 H01L23/367
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