| 发明名称 |
Method for fabricating a semiconductor device |
| 摘要 |
A method for fabricating a semiconductor device reduces soft errors, thereby enhancing reliability of the semiconductor device. In the method, a benzo cyclo butene (BCB) layer having a low water intake rate and an excellent blocking effect against alpha particles is formed between an alpha particle source such as a solder ball and sensitive integrated circuit devices such as a memory cell.
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| 申请公布号 |
US6410414(B1) |
申请公布日期 |
2002.06.25 |
| 申请号 |
US19990416403 |
申请日期 |
1999.10.12 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JOO-HERN |
| 分类号 |
H01L23/52;H01L21/3205;H01L21/321;H01L21/50;H01L21/56;H01L21/60;H01L21/768;H01L23/12;H01L23/29;H01L23/31;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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