| 摘要 |
A polishing apparatus for polishing a surface of a workpiece has a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning a polished surface of the workpiece, a rotating mechanism for rotating the workpiece during cleaning or after cleaning, and a sensor for detecting a reference position of the workpiece. The polishing apparatus further having a controller for controlling the rotating mechanism to stop the workpiece against rotation to align the reference position with a predetermined position based on a detecting signal from the sensor, and a film thickness measuring device for measuring a thickness of a polished surface layer of the aligned workpiece. |
