发明名称 CUTTING MATERIAL POSITIONING DEVICE FOR CUTTING MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a cutting material positioning device making a cutting portion easy to be seen in which laser beam is not irradiated at the time of cutting by solving a problem of the cutting portion which is difficult to be seen because the cutting portion is irradiated with laser beam even when performing a cutting work in a provided conventional laser irradiating type cutting material positioning device for positioning the cutting material for a cutting blade while aligning a marking line (cutting portion) of the cutting material with laser beam. SOLUTION: This device is constituted so as to mount laser oscillators 21 and 22 for irradiating a support 7 for tilting and supporting a table 3 with laser beam L, to mount a light shielding member 23 for shielding laser beam L on a circular saw body 10 and to shield laser beam L by the light shielding member 23 when the circular saw body 10 moves downward.
申请公布号 JP2002178220(A) 申请公布日期 2002.06.25
申请号 JP20000379435 申请日期 2000.12.13
申请人 MAKITA CORP 发明人 KONDO TAKAYOSHI;SHINOSE HIDEKI
分类号 B23D47/04;B23D45/04;B23D45/14;B23D47/00;B27B9/00;(IPC1-7):B23D47/04 主分类号 B23D47/04
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