发明名称 |
CUTTING MATERIAL POSITIONING DEVICE FOR CUTTING MACHINE |
摘要 |
PROBLEM TO BE SOLVED: To provide a cutting material positioning device making a cutting portion easy to be seen in which laser beam is not irradiated at the time of cutting by solving a problem of the cutting portion which is difficult to be seen because the cutting portion is irradiated with laser beam even when performing a cutting work in a provided conventional laser irradiating type cutting material positioning device for positioning the cutting material for a cutting blade while aligning a marking line (cutting portion) of the cutting material with laser beam. SOLUTION: This device is constituted so as to mount laser oscillators 21 and 22 for irradiating a support 7 for tilting and supporting a table 3 with laser beam L, to mount a light shielding member 23 for shielding laser beam L on a circular saw body 10 and to shield laser beam L by the light shielding member 23 when the circular saw body 10 moves downward.
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申请公布号 |
JP2002178220(A) |
申请公布日期 |
2002.06.25 |
申请号 |
JP20000379435 |
申请日期 |
2000.12.13 |
申请人 |
MAKITA CORP |
发明人 |
KONDO TAKAYOSHI;SHINOSE HIDEKI |
分类号 |
B23D47/04;B23D45/04;B23D45/14;B23D47/00;B27B9/00;(IPC1-7):B23D47/04 |
主分类号 |
B23D47/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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