| 发明名称 |
INTERCONNECTS WITH TI-CONTAINING LINERS |
| 摘要 |
PURPOSE: A liner for an electrical conductor in an electronic structure is provided that does not have the drawbacks or shortcomings of conventional liner materials. CONSTITUTION: A conductor in an electronic structure comprises a conductor body formed of an alloy that comprises between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, Sn and Hf, and a liner abutting the conductor body formed of an alloy that comprises Ta, W, Ti, Nb and V. |
| 申请公布号 |
KR20020048860(A) |
申请公布日期 |
2002.06.24 |
| 申请号 |
KR20010077462 |
申请日期 |
2001.12.07 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION. |
发明人 |
CABRAL CYRIL JR.;CARRUTHERS ROY ARTHUR;HARPER JAMES MCKELL EDWIN;HU CHAO-KUN;LEE, KIM YANG;NOYAN ISMAIL CEVDET;ROSENBERG ROBERT;SHAW THOMAS MCCARROLL |
| 分类号 |
H01L21/28;B32B15/01;C22C27/02;H01L21/768;H01L23/532;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
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