CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to improve an efficiency and a defect due to particles by easily and quickly performing a connection or a separation between spins and a head using one touch method without tools. CONSTITUTION: A CMP apparatus partially comprises spins for circulating, a head for connecting and separating with the spins, a clamp part(130) connecting the spins with the head by simultaneously tightening the outer surfaces of the spins and the head. The clamp part(130) further includes a ring-type clamping frame(132) having edges separated each other for enclosing the outer surfaces of the spins and the head, a projection part(134) formed at one edge of the clamping frame(132), a lever(136) formed at the other edge of the clamping frame(132) for circulating with an alternating motion, and a fastener(138) connected with the lever(136) for locking the clamping frame(132) with the projection part(134). At this point, a connection or a separation are easily performed without tools.