发明名称 Barrier layer for electrical connectors and methods of applying the layer
摘要 A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, wherein the barrier layer is selected from the group consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, and rhodium
申请公布号 AU3960402(A) 申请公布日期 2002.06.24
申请号 AU20020039604 申请日期 2001.12.11
申请人 HANDY AND HARMAN 发明人 AMIT DATTA
分类号 B32B15/04;B32B15/20;C23C28/00;C23C28/02;C25D3/00;C25D3/12;C25D3/56;C25D5/10;C25D5/34;C25D7/00;H01L;H01R13/03 主分类号 B32B15/04
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