摘要 |
PURPOSE: A tweezer is provided to restrain a scratch on a wafer by previously preventing a contact between wafers. CONSTITUTION: A tweezer comprises an adsorbing part(26) formed with an intake hole(24) for handling a wafer, an air jetting part formed on the rear surface of the adsorbing part(26) for spraying an air to a non-handling wafer so as to previously prevent a contact between the handling wafer and the non-handling wafer, a supporting bar(28) connected with the adsorbing part(26), an intake hose(27) included in the supporting bar(28), and an exhaust hose(32) included in the supporting bar(28) and located along the intake hose(27) having a defined distance each other. The air jetting part further includes an exhaust hole(30) symmetric with respect to the intake hole(24) using the adsorbing part(26) as a base, thereby preventing a scratch.
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