BOTH-SIDED ADHESIVE TAPE STRUCTURE

摘要

PURPOSE: A both-sided adhesive tape structure is provided to restrain a void in bonding a die of a semiconductor device by performing an embossing on the both-sided adhesive tape and by forming holes in the embossing parts. CONSTITUTION: Both-sides adhesive tape structure(6) made of an elastomer comprises an array of embossing parts(6a) and through-holes respectively formed in the embossing parts(6a). The both-sides adhesive tape structure(6) is located between a semiconductor chip mounted plate(1) and a semiconductor chip(2) so as to fix the semiconductor chip mounted plate(1) with the semiconductor chip(2) by pressurizing with a constant power and time, thereby absorbing voids generated between the semiconductor chip mounted plate(1) with the semiconductor chip(2) through the embossing parts(6a) and the holes.