发明名称 |
Process for securing a microwave module to a support |
摘要 |
The present invention relates to a process for securing to a metal support at least one microwave electronic module made on a substrate one of whose faces forms an earth plane. The process consists in depositing between the face forming the earth plane and the metal support, at least one strip of conducting adhesive at the level of the zones of breakage of the earth plane. The invention applies to the microwave field. |
申请公布号 |
AU1702702(A) |
申请公布日期 |
2002.06.24 |
申请号 |
AU20020017027 |
申请日期 |
2001.11.14 |
申请人 |
THOMSON LICENSING S.A. |
发明人 |
GERARD HAQUET;CHARLINE GUGUEN;CORINNE NICOLAS |
分类号 |
H05K1/02;H01P1/00;H05K1/14;H05K3/00;H05K3/32 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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