发明名称 |
Liquid ejecting head and liquid ejecting apparatus |
摘要 |
A liquid ejecting apparatus is provided with an actuator substrate on which a piezoelectric actuator that generates a pressure change in a pressure generation chamber, which is in communication with a nozzle opening that ejects a liquid, is provided. The liquid ejecting head is provided with lead-out wiring that is led out from the piezoelectric actuator to the top of the actuator substrate, the lead-out wiring is provided with an adhesive layer that is provided on an actuator substrate side, and a conductive layer that is provided on a side of the adhesive layer which is opposite the actuator substrate, and the adhesive layer has a width that is narrower than the conductive layer in at least a parallel arrangement direction of the lead-out wiring. |
申请公布号 |
US9403361(B2) |
申请公布日期 |
2016.08.02 |
申请号 |
US201414531683 |
申请日期 |
2014.11.03 |
申请人 |
Seiko Epson Corporation |
发明人 |
Takabe Motoki |
分类号 |
B41J2/05;B41J2/045;B41J2/14 |
主分类号 |
B41J2/05 |
代理机构 |
Workman Nydegger |
代理人 |
Workman Nydegger |
主权项 |
1. A liquid ejecting head comprising:
an actuator substrate on which a piezoelectric actuator that generates a pressure change in a pressure generation chamber is provided, wherein the pressure generation chamber is in communication with a nozzle opening that ejects a liquid; lead-out wiring that is led out from the piezoelectric actuator to a top of the actuator substrate, the lead-out wiring including:
an adhesive layer that is provided on an actuator substrate side, anda conductive layer that is provided on a side of the adhesive layer which is opposite the actuator substrate, andwherein the adhesive layer has a width that is narrower than a width of the conductive layer in at least a parallel arrangement direction of the lead-out wiring; and a wiring substrate that includes a connection wiring, wherein the connection wiring is electrically connected to the lead-out wiring, and wherein the lead-out wiring and the actuator substrate, and the wiring substrate and the connection wiring are joined using an adhesive. |
地址 |
Tokyo JP |