A METHOD OF MEASURING A STRENGTH OF A WAFER

摘要

The present invention provides a method for measuring strength of a wafer, which comprises the following steps of: measuring first flatness of a wafer; forming first and second layers on the front side of the wafer; measuring second flatness of the wafer, wherein the first and second layers are formed on the front side of the wafer; measuring flatness difference between the first flatness and second flatness; and determining the strength of the wafer based on the measured flatness difference.