| 摘要 |
PURPOSE: A semiconductor package is provided to improve a thermal emission property and to reduce a size and a weight by forming a semiconductor chip mounting plate on an upper surface of a chip. CONSTITUTION: A semiconductor package comprises a semiconductor chip mounting plate(3) mounted on an input/output pads(1a) formed upper surface of a first semiconductor chip(1) using an adhesive layer(7) in a resin molding part(30), and a second semiconductor chip(2) adhered to the other surface of the first semiconductor chip(1) using both sides adhesive tape(8). At this point, the input/output pads(2a) are formed on the upper surface of the second semiconductor chip(2) and the other surface of the second semiconductor chip(2) is exposed to the outer of the resin molding part(30).
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