发明名称 SOLDERING APPARATUS
摘要 PURPOSE: A soldering apparatus is provided to improve safety of an operator by installing an additional apparatus like a gas absorbing unit, and to reduce deformation of a material by making the tip of an iron apparatus have various types according to the condition of a bonding process. CONSTITUTION: Power is applied to the tip(20) installed in a holder(10). The tip directly supplies heat to the material and melts the material. A heater transfers heat to the tip, installed in a side of the tip and surrounding the tip. The heater radiates the heat to the outside of the holder to form a bonding atmosphere. A power apply unit applies power to the heater, connected to the heater.
申请公布号 KR20020047565(A) 申请公布日期 2002.06.22
申请号 KR20000076053 申请日期 2000.12.13
申请人 CHANG, KWAN YOUNG 发明人 CHANG, KWAN YOUNG;JUN, IL SEON
分类号 H01L23/488;(IPC1-7):H01L23/488 主分类号 H01L23/488
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