| 摘要 |
PURPOSE: A semiconductor device manufacturing apparatus is provided to minimize manufacturing defects in an ashing by maximizing a ground effect. CONSTITUTION: A semiconductor device manufacturing apparatus comprises a chamber(100) having a temperature detecting sensor(102) supplied an electric source for generating RF(Radio Frequency) power from an electric source supplier(112), a controller(110) controlling the electric source supplier(112), an A/D(Analog to Digital) converter(106), and a display(108) displaying a temperature detecting signal. The semiconductor device manufacturing apparatus further includes a terminal connector(104) insulated between signal lines by an insulating material, insulated between signal lines for the temperature detecting sensor(102) and another signal lines for the A/D converter(106) and internally connected between the signal lines for the sensor(102) and the signal lines for the A/D converter(106) in the terminal connector(104). At this point, the terminal connector(104) is fixedly adhered on a specific position, thereby increasing a ground effect.
|
