| 摘要 |
The particles (7) used to form the pattern are individual particles bonded to the target surface (5) by adhesive forces such as electrostatic, magnetic, hydrophobic, capillary or Van der Waals forces, or covalent bonds. A method for providing surfaces with patterns on the nanometer scale or on a larger scale comprises contacting a patterned punch (3) with the target surface, the latter being covered with particles intended for building up the desired end pattern (8). Contact of the punch with the target surface will cause some of these particles to be removed, leaving the punch pattern imprinted on the target surface. The particles used to form the pattern are individual particles which are fixed to the surface in a given position by adhesive forces such as electrostatic, magnetic, hydrophobic, capillary or Van der Waals forces, or covalent bonds. Independent claims are also included for devices with a surface pattern prepared by this method. |
