发明名称 POLYAMIDE RESIN COMPOSITION FOR FORMING FILM
摘要 PURPOSE: Provided is a polyamide resin composition for forming film capable of being applied as packing material having increased dimensional stability, tensile strength, mechanical strength, gas-blocking and slipping properties. CONSTITUTION: The composition comprises 88-99.8 wt% of nylon 6 or copolymer as a main material comprising nylon 6; 0.01-10 wt%(based on the amount of the nylon 6 or the copolymer) of fluormica having swelling property; and 0.01-2 wt% of minerals consisting of 1 or 2 or more selected from the group consisting of silica, kaolin, and talc, which are inert, inorganic additives. The film produced from the composition has excellent physical property and slipping property.
申请公布号 KR20020048104(A) 申请公布日期 2002.06.22
申请号 KR20000077391 申请日期 2000.12.16
申请人 HYOSUNG CORPORATION 发明人 CHO, IN SIK;CHO, JUN SANG
分类号 C08L77/00 主分类号 C08L77/00
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