SEMICONDUCTOR DEVICE WITH IDENTIFICATION NUMBER, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

摘要

PURPOSE: To economically provide an ultra-small semiconductor device bearing an identification number by efficiently using an electron beam drawing method. CONSTITUTION: A memory for identifying a 128 bit identification number which uses a transistor comprises a contact hole selectively formed by an electron beam drawing method. The major side length of a semiconductor chip is 0.5 nm or shorter in top view. The contact hole is generated at the same time when a contact hole of a surrounding circuit is generated. The major side length, in top view, of the semiconductor chip is smaller than the thickness of a wafer before manufacturing while allowed to be larger than the thickness after the wafer is made thinner. The same data as a bar code is stored in a memory separately. A data provided by encrypting the identification number is used to inspect a semiconductor chip.