| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board in which printability of solder paste and mountability of an electronic device having solder bumps, e.g. BGA, CSP, and the like, are enhanced and reliability of a mounted electronic device module is improved. SOLUTION: In the printed board 1 for mounting an electronic device having solder bumps, the group of through holes 3 proximate to mounting pads 2 for connection with the solder bumps of the electronic device is covered collectively with an insulating material 4. Marking ink (silk), solder resist or an insulation film is used as the coating material. Since the coating film can be made uniform in thickness and can be made thin entirely, printability of solder paste is enhanced and defective print can be reduced. Furthermore, mountability of the electronic device having solder bumps, e.g. BGA, CSP, and the like, is enhanced because planarity of the device mounting face is maintained and defective mounting can be reduced.
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