发明名称 METHOD FOR FORMING WIRING PATTERN
摘要 PROBLEM TO BE SOLVED: To form a wiring pattern more stably. SOLUTION: The method for forming a wiring pattern comprises a first step for forming recesses of specified shape on the major surface of a plate 101 made of a planar material, a second step for filling the recesses with a wiring material 103, a third step for abutting the major surface of the plate 101 against a substrate 111 in a container where the pressure is reduced to a specified level, and a fourth step for separating the plate 101 from the substrate 111 under a state where the pressure in the container is set at a specified level, transferring the wiring material 103 filling the recesses to the substrate 111 and forming a pattern 102a of the wiring material 103 defined by the recesses of the plate 101, on the substrate 111.
申请公布号 JP2002176243(A) 申请公布日期 2002.06.21
申请号 JP20000369525 申请日期 2000.12.05
申请人 NIPPON TELEGR & TELEPH CORP <NTT>;DAINIPPON SCREEN MFG CO LTD 发明人 MACHIDA KATSUYUKI;SATO NORIO;KURAKI OKU;IZEKI IZURU;KAMIYAMA TSUTOMU
分类号 B41M1/06;H05K3/12;H05K3/20;(IPC1-7):H05K3/20 主分类号 B41M1/06
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