发明名称 |
METHOD FOR FORMING WIRING PATTERN |
摘要 |
PROBLEM TO BE SOLVED: To form a wiring pattern more stably. SOLUTION: The method for forming a wiring pattern comprises a first step for forming recesses of specified shape on the major surface of a plate 101 made of a planar material, a second step for filling the recesses with a wiring material 103, a third step for abutting the major surface of the plate 101 against a substrate 111 in a container where the pressure is reduced to a specified level, and a fourth step for separating the plate 101 from the substrate 111 under a state where the pressure in the container is set at a specified level, transferring the wiring material 103 filling the recesses to the substrate 111 and forming a pattern 102a of the wiring material 103 defined by the recesses of the plate 101, on the substrate 111.
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申请公布号 |
JP2002176243(A) |
申请公布日期 |
2002.06.21 |
申请号 |
JP20000369525 |
申请日期 |
2000.12.05 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT>;DAINIPPON SCREEN MFG CO LTD |
发明人 |
MACHIDA KATSUYUKI;SATO NORIO;KURAKI OKU;IZEKI IZURU;KAMIYAMA TSUTOMU |
分类号 |
B41M1/06;H05K3/12;H05K3/20;(IPC1-7):H05K3/20 |
主分类号 |
B41M1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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