| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor measuring apparatus having a probe contact which has little slide quantity with a uniform needle pressure ensured and can match fine pitches. SOLUTION: A prober 10 has a moving control stage 11 for mounting a semiconductor wafer WF and a circuit base 12 for transferring signals with a tester 14. The circuit base 12 has a region facing the semiconductor wafer WF which forms a contacting board 124. A conductive wire-containing sheet 13 is provided between the contacting board 124 and a chip region of the semiconductor wafer WF and contains conductive wires 131 (say, probe) inside and the wires 131 are erected and arranged in the sheet 13, corresponding to electrodes of both the contacting board 124 and the chip region of the wafer WF.
|
