发明名称 COOLING MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide larger cooling without changing the arrangement of a structure including a heat radiation source. SOLUTION: Heat from MPU 22 is transmitted not only to a case 3 but also to a sheet metal 4 on a connection part 23 side facing MPU 22 and is efficiently led to a cooling part 25 near a ventilation device 9. Heat propagating to the cooling part 25 is thermally exchanged with air and is discharged outside a cooling module 2 from a discharge port 13. Thus, cooling larger than a conventional one can easily be obtained without changing the arrangement of the structure including MPU 22 at every time.</p>
申请公布号 JP2002176280(A) 申请公布日期 2002.06.21
申请号 JP20000373416 申请日期 2000.12.07
申请人 TOSHIBA HOME TECHNOLOGY CORP 发明人 KOBAYASHI TAKASHI;KANDA WATARU
分类号 H05K7/20;H01L23/36;(IPC1-7):H05K7/20 主分类号 H05K7/20
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