发明名称 |
COOLING MODULE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide larger cooling without changing the arrangement of a structure including a heat radiation source. SOLUTION: Heat from MPU 22 is transmitted not only to a case 3 but also to a sheet metal 4 on a connection part 23 side facing MPU 22 and is efficiently led to a cooling part 25 near a ventilation device 9. Heat propagating to the cooling part 25 is thermally exchanged with air and is discharged outside a cooling module 2 from a discharge port 13. Thus, cooling larger than a conventional one can easily be obtained without changing the arrangement of the structure including MPU 22 at every time.</p> |
申请公布号 |
JP2002176280(A) |
申请公布日期 |
2002.06.21 |
申请号 |
JP20000373416 |
申请日期 |
2000.12.07 |
申请人 |
TOSHIBA HOME TECHNOLOGY CORP |
发明人 |
KOBAYASHI TAKASHI;KANDA WATARU |
分类号 |
H05K7/20;H01L23/36;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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