| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit that can correct electric characteristic in manufacturing process and can improve the electric characteristic and the yield, and can reduce a dispersion in characteristics as products. SOLUTION: The optimum correction information is calculated (step S402) based on an electric characteristic result of an IC chip in the packaged IC chip just before delivery determined as a defective in an inspection process (step S401), and the calculated correction information is written in a nonvolatile memory for correction inside the IC chip to correct the electric characteristic of the IC chip (step S403). The corrected IC chip is thereafter fed again into the same inspection process (step 401). |
