发明名称 BIODEGRADABLE RESIN COMPOSITION, PACKAGING MATERIAL, METHOD FOR PRODUCING BIODEGRADABLE RESIN COMPOSITION AND METHOD FOR IMPROVING ELASTIC MODULUS OF THE BIODEGRADABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a biodegradable resin composition having improved elastic modulus by compounding synthetic mica in an aliphatic polyester resin. SOLUTION: This resin is obtained by compounding 0.5-20.0 wt.% synthetic mica in polylactic acid as an aliphatic polyester resin. The synthetic mica is preferably nonswelling mica. A carbodiimide compound (0.1-2.0 wt.% per resin) is preferably compounded in the polylactic acid as an additive for suppressing hydrolysis of the polylactic acid. The biodegradable resin composition is preferably aged at 80-130 deg.C for 30-180 s. The biodegradable resin is useful as a raw material for household electric appliances and packaging materials and the like.
申请公布号 JP2002173583(A) 申请公布日期 2002.06.21
申请号 JP20000372426 申请日期 2000.12.07
申请人 SONY CORP 发明人 FUJIHIRA HIROKO;NOGUCHI TSUTOMU;MORI HIROYUKI
分类号 B29C45/73;C08K3/34;C08K5/29;C08L67/00;C08L101/16;(IPC1-7):C08L67/00 主分类号 B29C45/73
代理机构 代理人
主权项
地址