METHOD FOR MANUFACTURING CHEMICAL MECHANICAL POLISHING PAD CONDITIONER

摘要

PURPOSE: A fabrication method of a CMP(Chemical Mechanical Polishing) pad conditioner is provided to prevent damages of wafers and to increase a yield by using a ceramic pad conditioner. CONSTITUTION: A pad conditioner is entirely made of a ceramic using α-alumina having a good sinterability, thereby preventing a scratch and a metal contamination. After compressing the α-alumina to form a spherical disc in a compression die under a powder metallurgy processing, A main substrate(1) is formed by first sintering the spherical disc for one hour over the temperature of 1000 deg.C. At this time, the structure of the sintered substrate nearly has no pores. After depositing diamond grains(2) on the main substrate(1), a second sintering is performed on the α-alumina power(3) deposited on the structure over the temperature of 1000 deg.C.