| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealed semiconductor device for easily preventing an internal lead and a semiconductor chip from approaching too much each other when sealing the semiconductor chip and the internal lead with a molding resin. SOLUTION: In the LOC type semiconductor device, a die pad material 4 is put on a die pad 3 and a semiconductor chip 1 is fixed to the die pad 3. A lead 2 including an internal lead 2a extended even to the neighborhood of the pad mounted in the semiconductor chip 1 is provided. Between the internal lead 2a and the semiconductor chip 1, a tape material 8 is provided at a position corresponding to four corners of the semiconductor chip 1. The tape material 8 is fixed by bonding only on the internal-lead 2a side, and not fixed by bonding on the semiconductor 1 side, and put only in contact with the surface of the semiconductor chip 8. |
