发明名称 AQUEOUS PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN PLATE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an aqueous photosensitive resin composition suitable for a printing resin plate and giving a cured body excellent in water and solvent resistances and having such an excellent flexibility that it does not crack even in the winter dry season. SOLUTION: The aqueous photosensitive resin composition comprises an aqueous dispersion containing a urethane oligomer (A) containing an anionic hydrophilic group and a hydrophobic polyoxyalkylene structure of the formula -(CH2)nO- (where (n) is an integer of >=3) in each molecule, having a photo- curable ethylenically unsaturated group at the end of each molecule and obtained by reacting diol compounds containing 75-95 wt.% diol compound having a polyoxyalkylene structure of the formula -(CH2)nO- with polyisocyanate.
申请公布号 JP2002174898(A) 申请公布日期 2002.06.21
申请号 JP20000373101 申请日期 2000.12.07
申请人 HITACHI CHEM CO LTD 发明人 IN AKIRA;ITO TOSHIHIKO;SHIODA MAKOTO
分类号 G03F7/027;C08F2/46;C08F299/06;C08G18/67;C08L75/16;C08L101/00;G03F7/00;G03F7/028;G03F7/032 主分类号 G03F7/027
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