发明名称 |
AQUEOUS PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN PLATE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an aqueous photosensitive resin composition suitable for a printing resin plate and giving a cured body excellent in water and solvent resistances and having such an excellent flexibility that it does not crack even in the winter dry season. SOLUTION: The aqueous photosensitive resin composition comprises an aqueous dispersion containing a urethane oligomer (A) containing an anionic hydrophilic group and a hydrophobic polyoxyalkylene structure of the formula -(CH2)nO- (where (n) is an integer of >=3) in each molecule, having a photo- curable ethylenically unsaturated group at the end of each molecule and obtained by reacting diol compounds containing 75-95 wt.% diol compound having a polyoxyalkylene structure of the formula -(CH2)nO- with polyisocyanate. |
申请公布号 |
JP2002174898(A) |
申请公布日期 |
2002.06.21 |
申请号 |
JP20000373101 |
申请日期 |
2000.12.07 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
IN AKIRA;ITO TOSHIHIKO;SHIODA MAKOTO |
分类号 |
G03F7/027;C08F2/46;C08F299/06;C08G18/67;C08L75/16;C08L101/00;G03F7/00;G03F7/028;G03F7/032 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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