| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing equipment which enables application of even a small amount of resist on the entire surface of a substrate, even if the resist has a high viscosity or the substrate has a poor wettability, and also to provide a method of manufacturing a semiconductor device. SOLUTION: A wafer 1 is held on the upper surface of a chuck 13, and the chuck 13 is connected to a spin motor 15, motor pedestal 17, and air cylinder shaft 19. The spin motor 15 can be rotates about the vertical axis, and the air cylinder shaft 19 can be moved vertically. When the resist 5 is dropped on the wafer 1, the spin motor 15 is turned, and at the same time, air is supplied to an air cylinder 21 to move the air cylinder shaft 19 in the upward direction. The chuck 13 is moved upward, being rotated by these movements. The resist 5 is expanded on the surface of the wafer 1, while being pressed against the wafer 1, to be applied on the entire surface of the wafer 1. |
