发明名称 INTERCONNECTION OF MULTI-CONDUCTOR
摘要 PROBLEM TO BE SOLVED: To substantially reduce the width of the interconnect a multi- conductor. SOLUTION: For reducing the width of a selected part of an interconnect 64, each conductor is divided between two or more layers 36 and 52. Each conductor in one group extends along one part of the 1st layer 36 and jumps to and continues along the 2nd layer 52. The remaining each layer extends only along the 1st layer 36. As a result, the width of the interconnect 64 where the conductors are divided between the layers 36 and 52, can be substantially reduced.
申请公布号 JP2002175603(A) 申请公布日期 2002.06.21
申请号 JP20010212957 申请日期 2001.07.13
申请人 HEWLETT PACKARD CO <HP> 发明人 POORMAN PAUL W
分类号 G11B5/60;G02B6/38;G11B5/10;G11B5/127;G11B5/29;G11B5/31;G11B5/48;H01R12/61;H01R31/06;H05K1/11;H05K1/14;(IPC1-7):G11B5/127 主分类号 G11B5/60
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