HEAT-ADHESIVE POLYOLEFIN RESIN COMPOSITION

摘要

PURPOSE: A heat-adhesive polyolefin resin composition is provided, to improve heat adhesive power and blocking resistance of a film by inhibiting the production of low crystalline materials and to reduce the roll mark generated in a film process. CONSTITUTION: The heat-adhesive polyolefin resin composition comprises 100 parts by weight of a crystalline ethylene-propylene-1-butene terpolymer which has a melting point of 125-135 deg.C; and 1-10 parts by weight of an ethylene-α-olefin copolymer which has a density of 0.85-0.90 and a melting index(230 deg.C) of 1-10 and is prepared by using a single active site catalyst.