Printed circuit cooling plate mechanism having cooling plate with flexible pressure electronic components applied and wire connections printed circuit connected.

摘要

The cooling mechanism has a cooling plate (3) with a printed circuit plate (4) placed in parallel. The electronic circuits (2) are placed on the cooling plate in contact with it. Connection elements (21) connect to the printed circuit, and pressure is applied (1) to the electronic components with a flexible frame section (11) and flexible sections (13).