ELECTRONIC PARTS, CIRCUIT DEVICE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive and thin substrate incorporating parts, which incorporates the electronic parts with high density, whose insulating layer is formed of resin and which has high function, and to provide a manufacturing method and a semiconductor package using the substrate incorporating the parts, loading a semiconductor chip for functioning. SOLUTION: The thin film electronic part with bumps 13 for interlayer connection is laminated on the substrate 10. Thus, the part is incorporated and interlayer connection is realized. Then, the circuit device of high density is constituted. For forming the thin film electronic part 13, a recessed part being the mold of a bump is formed on a template and an electrode and an element are sequentially formed on the template. Consequently, the fine thin film electronic part with bumps superior in a characteristic is formed in a simple process.