RESIN BOARD, METHOD OF MANUFACTURING THE SAME, CONNECTION INTERMEDIATE PRODUCT, CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a circuit board having small connection resistance and superior connection stability. SOLUTION: A compression function layer 60 is disposed on at least one surface of the board. The compression function layer 60 gives a function for compression by receiving pressurization in the direction of board thickness to a resin substrate 10 including the layer. Thus, sufficient pressure is applied to a conductor 14.